Semiconductor Materials
      Materials for Poly-Si Deposition

      This gas is used in the semiconductor manufacturing process to form a uniform film at low temperature and high speed during thin film deposition.

      Si2H6

      Also known as disilane or disilane, it is a type of specialty gas used in diffusion and CVD processes during semiconductor manufacturing.

      Chemical name Disilane
      Cas No. 1590-87-0
      Molecular formula Si2H6
      Molar Weight 62.22 g/mol
      Physical State / Color Colorless gas
      Boiling point -14 ℃