반도체 소재
사업소개
반도체 소재
Precursor
Gas
Bulk Chemical
Cu Slurry
Product Name
H2O2 Contents (wt.%)
Dilution Ratio
CBS-7000
Performance
Physical Properties
Cu R/R
8,000 Å/min
pH
7.0 ± 0.5
Abrasive Size [nm]
70
1.0
Slurry : DIW ( 1 : 9 )