Materials for Double Patterning Technology

As semiconductor devices continue to miniaturize, resulting in decreasing line widths, the development of EUV Lithography equipment for implementing patterns below 30nm is ongoing. However, due to difficulties in applying EUV to mass production, DPT (Double Patterning Technology) processes utilizing existing equipment have been introduced. BDEAS and BTBAS are etch films required for the DPT process and are used as essential materials for pattern implementation along with PR.